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Non-contact transport device - List of Manufacturers, Suppliers, Companies and Products

Non-contact transport device Product List

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Bernoulli chuck with vertical gas jet method

Bernoulli chuck with vertical gas jet method

Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.

The new mechanism adopts the "vertical gas jet method." This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction losses of the gas flow within the chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved stability of the holding mechanism, increased resistance to shocks, and nearly halving the gas consumption. The "float chuck" generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state while floating in the air, enabling transportation, inversion, and tilting.

  • Wafer
  • CVD Equipment
  • Articulated Robot
  • Non-contact transport device

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Non-contact sheet laminating device

Non-contact sheet laminating device

Laminating substrates, films, and FPCs with high speed and precision.

The film that has been sent is accurately aligned and accumulated in a non-contact manner. This device consists of a holding mechanism called "Float Chuck," which was developed by our company, that suspends the deflection plate, FPC, and film in a non-contact state by blowing air to keep them floating in the air. It also employs a "non-contact support running device" that moves in synchronization with the work progression. It reliably and accurately accumulates thin and flexible workpieces at high speed without causing dirt adhesion or damage.

  • Other conveying machines
  • Non-contact transport device

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Non-contact sheet and film laminating device

Non-contact sheet and film laminating device

Non-contact, high-speed, and precise stacking of the sent bias plates, films, and sheets.

1. Features a. Stacking and layering without contact b. Does not cause scratches or dirt on the film c. High speed e. Clean 2. Applications a. Polarizing plates b. FPC (Flexible Printed Circuit) c. Plastic sheets d. Bright metallic sheets

  • Other semiconductor manufacturing equipment
  • Non-contact transport device

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Non-contact tweezers T-type

Non-contact tweezers T-type

Tweezers that grasp wafers non-contactly by manual operation.

The wafer is grasped and transported non-contact through manual operation. There are no scratches, dirt, or damage.

  • Other semiconductor manufacturing equipment
  • Non-contact transport device

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Non-contact robotic hand for carriers

Non-contact robotic hand for carriers

A robotic hand that inserts and removes wafers to and from a carrier without contact.

Wafers can be transported non-contact. The thin hand allows for the insertion and removal of wafers to and from the carrier. Usable in a clean room. Alignment is possible.

  • Other industrial robots
  • Other semiconductor manufacturing equipment
  • Pneumatic Equipment
  • Non-contact transport device

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Sheet supply device

Sheet supply device

High-speed supply of stacked breathable sheets, films, non-woven fabrics, and paper one by one using a non-contact transport device called "Float Chuck."

Breathable thin sheets. Compatible with film, non-woven fabric, and paper. Dispenses one sheet at a time. High speed.

  • Circuit board processing machine
  • Non-contact transport device

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Micro Lens Bernoulli Chuck

Micro Lens Bernoulli Chuck

Transporting micro lenses non-contact.

We will suspend and transport micro lenses for camera-equipped mobile phones, digital cameras, medical cameras, and industrial compact cameras in a non-contact state, floating in the air. No scratches or dirt will be attached.

  • lens
  • Non-contact transport device

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Ultra-thin curved plate non-contact chuck

Ultra-thin curved plate non-contact chuck

Non-contact transport device for gripping ultra-thin warped wafers without touching them.

◎ Features 1. Non-contact handling and transport of ultra-thin warped wafers and plate-like bodies 2. Does not damage the wafer 3. Does not leave any dirt ◎ Applications 1. Warped wafers 2. GaSa wafers 3. Ultra-thin wafers 4. Surface-treated wafers

  • Other semiconductor manufacturing equipment
  • CVD Equipment
  • Heating device
  • Non-contact transport device

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Film delivery, transport, stacking device

Film delivery, transport, stacking device

A device that sends out, transports, and stacks laminated films one by one.

◎Features 1. Sends out laminated films one by one. 2. Transports without the tip drooping. 3. Laminates with high precision. 4. Prevents scratches and dirt from adhering. 5. Does not apply stress. 6. Does not generate static electricity.

  • Other conveying machines
  • Non-contact transport device

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Sheet feeding, conveying, and stacking device

Sheet feeding, conveying, and stacking device

Send out, transport, and stack sheets using air flow.

The device is designed to stack sheets such as amorphous solar cells, polarizers, films, sheets, wafers, glass, and paper using a non-contact transport system called "Float Chuck" (patented), which feeds out the stacked sheets one by one while ensuring that no drooping occurs at the leading edge, allowing for precise stacking. In the film feeding section, an "air flow feeding mechanism" (patented) is employed to reliably feed out the films one by one. The transport section utilizes the "Float Chuck," enabling transport without causing drooping at the leading edge of the film during the process. This allows for defect inspection of film reflection and transmission using sensors. The stacking section consists of a "non-contact suspended conveyor" formed by the non-contact transport device "Float Chuck," which drops thin, flexible films in a horizontal state and stacks them accurately at high speed.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Other packaging machines
  • Non-contact transport device

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Non-contact robotic hand

Non-contact robotic hand

Non-contact robotic hand

By ejecting gas, it generates negative pressure through the ejector effect and Bernoulli effect, and positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state, enabling transport, inversion, and tilting. It is also referred to as a Bernoulli chuck. The exhaust recovery mechanism allows for use in ultra-clean rooms. It is compatible with semiconductor wafers, LCD/PDP glass substrates, printed circuit boards, ceramic substrates, films, paper, non-woven fabrics, ultra-thin workpieces, breathable workpieces, and more.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Other machine elements
  • Non-contact transport device

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Film sheet transport device

Film sheet transport device

Film sheet conveying device

A chuck that holds and transports film, printed circuit boards, through-hole boards, paper, non-woven fabric, flexible sheets, and breathable sheets by ejecting gas.

  • Other conveying machines
  • Circuit board processing machine
  • Other machine elements
  • Non-contact transport device

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SRL Float Chuck Type PF

SRL Float Chuck Type PF

Non-contact gripping of preform lenses, and loading and unloading into the press mold.

The "SRL Float Chuck PF Type" preform lens transfer device is a system that retrieves preform lenses from a press machine in a completely non-contact manner during the press molding process. By ejecting air, it generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through the pressure chamber type air cushion effect and the airflow cushion effect, allowing the lens to be suspended and transported in a non-contact state while floating in the air. This non-contact loading and unloading device for preform lenses, "SRL Float Chuck PF Type," does not come into contact with the lens surface or the lens edge. As a result, it does not scratch or dirty the lens surface and side edges, and it also prevents dust generation.

  • lens
  • Other physicochemical equipment
  • Semiconductor inspection/test equipment
  • Non-contact transport device

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Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.

  • Other semiconductor manufacturing equipment
  • Other environmental equipment
  • Packaging materials
  • Non-contact transport device

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Non-contact transport system for glass substrates

Non-contact transport system for glass substrates

Non-contact transport system for glass substrates

The newly developed "Float Chuck Type C" series further adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it is being considered for use with heavy loads that were previously avoided due to air consumption issues, particularly for the 8th generation large glass substrates (2200mm x 2200mm) and PDP large glass substrates (2000mm x 2000mm) for non-contact transport. Additionally, the reduction in exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to impact, and does not put stress on glass substrates. It is also widely used for the non-contact transport of thin semiconductor wafers.

  • Other industrial robots
  • Other semiconductor manufacturing equipment
  • Other machine elements
  • Non-contact transport device

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Cleanroom-compatible "Bernoulli Chuck WAS Type"

Cleanroom-compatible "Bernoulli Chuck WAS Type"

Clean room compatible Bernoulli chuck that does not scatter debris.

The cleanroom-compatible "Bernoulli Chuck WAS type" efficiently suspends and transports workpieces in a non-contact state by ejecting gas. The "Bernoulli Chuck WAS type" is equipped with an exhaust recovery mechanism that captures the exhaust emitted from the nozzle, preventing the exhaust from leaking into the cleanroom. Therefore, it can be used for non-contact transport of wafers, glass substrates, and other items within the cleanroom.

  • Actuator
  • Wafer
  • Non-contact transport device

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50μm thick ultra-thin glass non-contact transport device LNAS type

50μm thick ultra-thin glass non-contact transport device LNAS type

Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"

The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air jet nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, as shown in the pressure distribution diagram, there is no localized stress applied to the ultra-thin glass by the high-pressure ejected air (it is in a negative pressure state). As a result, thin workpieces and fragile ultra-thin glass will not be damaged.

  • Stepper
  • Non-contact transport device

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Heat-resistant specification: Non-contact transport device "Float Chuck SAH type"

Heat-resistant specification: Non-contact transport device "Float Chuck SAH type"

Bernoulli chuck for non-contact transfer of high-temperature workpieces.

This product is manufactured according to the usage environment temperature and chemical specifications. The quartz glass used in ultra-high temperature applications possesses numerous characteristics, such as high purity, resistance to heat and acid, and high mechanical strength. It has become possible to transport wafers non-contact in cleaning tanks, oxidation diffusion furnaces, etching devices, CVD devices, etc., in the semiconductor manufacturing process, as well as non-contact transport of glass molding lenses. Additionally, products are made to suit various environments, including aluminum, SUS, PEEK, and others. ◎ Features 1. Heat resistance up to 1000°C 2. Materials are selected based on the usage temperature environment. PTFE, PEEK, aluminum, SUS316, quartz, considering acidic, alkaline, and corrosive gases. ◎ Target Work 1. High-temperature wafers 2. Glass molded lenses and preforms 3. Compound semiconductor wafers 4. Glass substrates

  • Evaporation Equipment
  • Wafer
  • Other industrial robots
  • Non-contact transport device

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Concave/Convex Lens Universal Bernoulli Chuck Type W

Concave/Convex Lens Universal Bernoulli Chuck Type W

Both convex and concave lenses are transported non-contact using the same Bernoulli chuck type W.

The non-contact transport device "Convex/Concave Lens Shared Bernoulli Chuck Type W" can maintain and transport items in a suspended state without contact by ejecting gas towards the lens. This is made possible by forming two types of curved surfaces, convex and concave lenses, on the operating surface opposing the lens (patent pending). When the gap between the operating surface and the lens is large, the gas ejection nozzle, cushion chamber, and the gap between the operating surface and the lens function as the nozzle, vacuum chamber, and diffuser of an ejector, respectively. As a result, a negative pressure is generated in the cushion chamber, pulling the lens closer. When the lens is drawn in and the gap with the operating surface decreases, the cushion chamber functions as a pressure chamber type air cushion (hovercraft), causing the pressure in the cushion chamber to rise sharply, which separates the lens. This maintains the lens in a non-contact suspended state in the air at a distance that automatically keeps the balanced pressure of the cushion chamber between the operating surface and the lens.

  • Other semiconductors
  • Other semiconductor manufacturing equipment
  • Other physicochemical equipment
  • Non-contact transport device

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Ultra-thin wafer non-contact transport device

Ultra-thin wafer non-contact transport device

Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.

TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.

  • Other semiconductor manufacturing equipment
  • Wafer
  • Semiconductor inspection/test equipment
  • Non-contact transport device

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Wafer chip non-contact transport device

Wafer chip non-contact transport device

Transporting micro wafer chips and micro lenses non-contact.

It is non-contact. It is possible to transport small workpieces non-contact. There are no scratches or dirt attached. There is no damage.

  • Other semiconductor manufacturing equipment
  • Other physicochemical equipment
  • Non-contact transport device

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Amorphous solar cells, film transport device

Amorphous solar cells, film transport device

Transport, stack, and send the film non-contact.

A device that non-contact feeds, transports, and laminates amorphous solar cells, polarizing plates, light guide plates, films, paper, and sheets. It employs a non-contact transport device called "Float Chuck" (patented), which transports films non-contact by blowing air. It does not allow scratches or dirt to adhere to the workpiece. It is also suitable for weak and fragile films.

  • Other industrial robots
  • Semiconductor inspection/test equipment
  • Other machine elements
  • Non-contact transport device

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10G glass substrate non-contact transport device

10G glass substrate non-contact transport device

10G glass substrate non-contact transport device

A non-contact transport device that holds and conveys workpieces in a suspended manner by ejecting gas. It employs a new mechanism for the gas ejection system, with the air ejection outlet positioned at a small angle relative to the workpiece. There is no deceleration of airflow velocity caused by friction losses due to wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it is adopted for the non-contact transport of large workpieces with high loads, particularly for the eighth generation large glass substrates (2200mm x 2200mm) used in LCDs, which had previously been avoided due to air consumption issues.

  • Other semiconductor manufacturing equipment
  • Other conveying machines
  • Transport and handling robots
  • Non-contact transport device

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Non-contact transfer device "Float Chuck WLNA Type"

Non-contact transfer device "Float Chuck WLNA Type"

Grip and transport FPC, through-hole boards, films, and breathable non-woven fabrics without causing damage.

It grips, chucks, and transports flexible materials such as film, amorphous solar cells, paper, green sheets, non-woven fabrics, breathable materials, foams, and soft bodies. By blowing air towards the workpiece, it generates negative pressure through the Bernoulli effect, allowing it to chuck, grip, transport, stack, and handle the workpiece in a non-contact state.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Other packaging machines
  • Non-contact transport device

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VGFS Non-contact Transport Device "Float Chuck SAC Type"

VGFS Non-contact Transport Device "Float Chuck SAC Type"

Adopting the gas vertical jet flow method (VGFS), the Bernoulli chuck "Float Chuck SAC type" series reduces friction loss in the gas flow.

The "Float Chuck SAC Type" series, which adopts the gas vertical jet flow system (VGFS) and reduces friction loss in the gas flow, has newly implemented this gas vertical jet flow method. The gas vertical jet flow method vertically jets the gas flow ejected from the nozzle into the cushion chamber, reducing friction loss in the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption.

  • Other semiconductor manufacturing equipment
  • Other machine elements
  • Transport and handling robots
  • Non-contact transport device

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Non-contact chuck "Float Chuck SA Type"

Non-contact chuck "Float Chuck SA Type"

Bernoulli chuck with air consumption reduced to one-third of the conventional amount.

Transport the workpiece non-contact. The air consumption is one-third of the conventional amount. The holding force is strong. It has excellent holding stability.

  • Other semiconductor manufacturing equipment
  • Chuck
  • Plasma Generator
  • Non-contact transport device

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Non-contact transport device for green sheets "Float Chuck SAG type"

Non-contact transport device for green sheets "Float Chuck SAG type"

Transporting green sheets by air.

The non-contact transport device for ceramic green sheets, "Float Chuck SAG Type," holds and transports ceramic green sheets in a non-contact manner by blowing air through gas. The "Float Chuck SAG Type" is equipped with a nozzle that prevents high-speed air flow from directly colliding with the green sheet, thereby protecting the thin and fragile green sheets, which are 120μm thick, from damage and breakage due to the high-speed air flow. Additionally, the "Float Chuck SAG Type" uses a small amount of air, making it efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets of 120μm thickness. 4. Can transport ceramic green sheets without bending them. 5. Low air consumption. 6. Does not pollute the environment.

  • Other conveying machines
  • Circuit board processing machine
  • Pneumatic Equipment
  • Non-contact transport device

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