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Non-contact transport device - List of Manufacturers, Suppliers, Companies and Products

Non-contact transport device Product List

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Bernoulli chuck with vertical gas jet method

Bernoulli chuck with vertical gas jet method

Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.

The new mechanism adopts the "vertical gas jet method." This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction losses of the gas flow within the chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved stability of the holding mechanism, increased resistance to shocks, and nearly halving the gas consumption. The "float chuck" generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state while floating in the air, enabling transportation, inversion, and tilting.

  • Wafer
  • CVD Equipment
  • Articulated Robot

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Non-contact sheet laminating device

Non-contact sheet laminating device

Laminating substrates, films, and FPCs with high speed and precision.

The film that has been sent is accurately aligned and accumulated in a non-contact manner. This device consists of a holding mechanism called "Float Chuck," which was developed by our company, that suspends the deflection plate, FPC, and film in a non-contact state by blowing air to keep them floating in the air. It also employs a "non-contact support running device" that moves in synchronization with the work progression. It reliably and accurately accumulates thin and flexible workpieces at high speed without causing dirt adhesion or damage.

  • Other conveying machines

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Non-contact sheet and film laminating device

Non-contact sheet and film laminating device

Non-contact, high-speed, and precise stacking of the sent bias plates, films, and sheets.

1. Features a. Stacking and layering without contact b. Does not cause scratches or dirt on the film c. High speed e. Clean 2. Applications a. Polarizing plates b. FPC (Flexible Printed Circuit) c. Plastic sheets d. Bright metallic sheets

  • Other semiconductor manufacturing equipment

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Non-contact tweezers T-type

Non-contact tweezers T-type

Tweezers that grasp wafers non-contactly by manual operation.

The wafer is grasped and transported non-contact through manual operation. There are no scratches, dirt, or damage.

  • Other semiconductor manufacturing equipment

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Non-contact robotic hand for carriers

Non-contact robotic hand for carriers

A robotic hand that inserts and removes wafers to and from a carrier without contact.

Wafers can be transported non-contact. The thin hand allows for the insertion and removal of wafers to and from the carrier. Usable in a clean room. Alignment is possible.

  • Other industrial robots
  • Other semiconductor manufacturing equipment
  • Pneumatic Equipment

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Sheet supply device

Sheet supply device

High-speed supply of stacked breathable sheets, films, non-woven fabrics, and paper one by one using a non-contact transport device called "Float Chuck."

Breathable thin sheets. Compatible with film, non-woven fabric, and paper. Dispenses one sheet at a time. High speed.

  • Circuit board processing machine

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Micro Lens Bernoulli Chuck

Micro Lens Bernoulli Chuck

Transporting micro lenses non-contact.

We will suspend and transport micro lenses for camera-equipped mobile phones, digital cameras, medical cameras, and industrial compact cameras in a non-contact state, floating in the air. No scratches or dirt will be attached.

  • lens

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Ultra-thin curved plate non-contact chuck

Ultra-thin curved plate non-contact chuck

Non-contact transport device for gripping ultra-thin warped wafers without touching them.

◎ Features 1. Non-contact handling and transport of ultra-thin warped wafers and plate-like bodies 2. Does not damage the wafer 3. Does not leave any dirt ◎ Applications 1. Warped wafers 2. GaSa wafers 3. Ultra-thin wafers 4. Surface-treated wafers

  • Other semiconductor manufacturing equipment
  • CVD Equipment
  • Heating device

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Film delivery, transport, stacking device

Film delivery, transport, stacking device

A device that sends out, transports, and stacks laminated films one by one.

◎Features 1. Sends out laminated films one by one. 2. Transports without the tip drooping. 3. Laminates with high precision. 4. Prevents scratches and dirt from adhering. 5. Does not apply stress. 6. Does not generate static electricity.

  • Other conveying machines

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Sheet feeding, conveying, and stacking device

Sheet feeding, conveying, and stacking device

Send out, transport, and stack sheets using air flow.

The device is designed to stack sheets such as amorphous solar cells, polarizers, films, sheets, wafers, glass, and paper using a non-contact transport system called "Float Chuck" (patented), which feeds out the stacked sheets one by one while ensuring that no drooping occurs at the leading edge, allowing for precise stacking. In the film feeding section, an "air flow feeding mechanism" (patented) is employed to reliably feed out the films one by one. The transport section utilizes the "Float Chuck," enabling transport without causing drooping at the leading edge of the film during the process. This allows for defect inspection of film reflection and transmission using sensors. The stacking section consists of a "non-contact suspended conveyor" formed by the non-contact transport device "Float Chuck," which drops thin, flexible films in a horizontal state and stacks them accurately at high speed.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Other packaging machines

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Non-contact robotic hand

Non-contact robotic hand

Non-contact robotic hand

By ejecting gas, it generates negative pressure through the ejector effect and Bernoulli effect, and positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state, enabling transport, inversion, and tilting. It is also referred to as a Bernoulli chuck. The exhaust recovery mechanism allows for use in ultra-clean rooms. It is compatible with semiconductor wafers, LCD/PDP glass substrates, printed circuit boards, ceramic substrates, films, paper, non-woven fabrics, ultra-thin workpieces, breathable workpieces, and more.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Other machine elements

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Film sheet transport device

Film sheet transport device

Film sheet conveying device

A chuck that holds and transports film, printed circuit boards, through-hole boards, paper, non-woven fabric, flexible sheets, and breathable sheets by ejecting gas.

  • Other conveying machines
  • Circuit board processing machine
  • Other machine elements

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SRL Float Chuck Type PF

SRL Float Chuck Type PF

Non-contact gripping of preform lenses, and loading and unloading into the press mold.

The "SRL Float Chuck PF Type" preform lens transfer device is a system that retrieves preform lenses from a press machine in a completely non-contact manner during the press molding process. By ejecting air, it generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through the pressure chamber type air cushion effect and the airflow cushion effect, allowing the lens to be suspended and transported in a non-contact state while floating in the air. This non-contact loading and unloading device for preform lenses, "SRL Float Chuck PF Type," does not come into contact with the lens surface or the lens edge. As a result, it does not scratch or dirty the lens surface and side edges, and it also prevents dust generation.

  • lens
  • Other physicochemical equipment
  • Semiconductor inspection/test equipment

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Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.

  • Other semiconductor manufacturing equipment
  • Other environmental equipment
  • Packaging materials

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Non-contact transport system for glass substrates

Non-contact transport system for glass substrates

Non-contact transport system for glass substrates

The newly developed "Float Chuck Type C" series further adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it is being considered for use with heavy loads that were previously avoided due to air consumption issues, particularly for the 8th generation large glass substrates (2200mm x 2200mm) and PDP large glass substrates (2000mm x 2000mm) for non-contact transport. Additionally, the reduction in exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to impact, and does not put stress on glass substrates. It is also widely used for the non-contact transport of thin semiconductor wafers.

  • Other industrial robots
  • Other semiconductor manufacturing equipment
  • Other machine elements

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